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Samsung Electronics, recognized as the leading manufacturer of memory chips globally, announced that it has commenced mass production of the slimmest mobile dynamic random access memory in the industry, the low-power double data rate 5X DRAM, specifically designed for on-device artificial intelligence applications.
Samsung Electronics, recognized as the leading manufacturer of memory chips globally, announced that it has commenced mass production of the slimmest mobile dynamic random access memory in the industry, the low-power double data rate 5X DRAM, specifically designed for on-device artificial intelligence applications.
The new 12-nanometer (nm) class packages, available in 12 gigabytes (GB) and 16 GB, measure just 0.65 mm in height, making them the thinnest LPDDR DRAM available. This innovative chip, which consists of four stacked layers of 12nm DRAM die, is 9 percent thinner and boasts a 21.2 percent improvement in heat resistance compared to its predecessor.
Samsung highlighted that these ultra-slim LPDDR5X DRAM packages will free up space in mobile devices, facilitating high-performance applications and advanced features such as on-device AI.
Bae Yong-Cheol, executive vice president at Samsung Electronics, stated that the LPDDR5X DRAM establishes a new benchmark for high-performance on-device AI solutions, combining exceptional LPDDR performance with advanced thermal management in a compact design. Additionally, the company has launched a unit focused on developing high-bandwidth memory (HBM) to reclaim its position in the AI semiconductor sector.
